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DATA SHEET
TANTALUM CAPACITOR
SV/H SERIES
SURFACE MOUNT RESIN MOLDED TANTALUM CHIP CAPACITORS HIGH RELIABILITY
NEC's SV/H series solid tantalum capacitor has developed for automotive application. Comparing to the former type (R Series), the higher reliability and the higher performance have been built in the same chip size with the NEC's original technologies.
FEATURES
The SV/H series has the highest level of reliability and performance in the tantalum chip capacitors as shown below. * Damp heat (steady state) * Resistance to soldering * Failure rate : 85C, 85% RH 1000 hours : 260C, 10 sec (Fully immersed to solder) : 0.5%/1000 hours (at 85C, rated voltage applied) * Rapid change of temperature: -55C to +125C, 1000 cycles
APPLICATIONS
* Automotive electronics * Other electronic equipment which requires high reliability and performance.
DIMENSIONS
L L
H
W1
L
W1
Y
W1
H H W2
Z
Z [A Case]
W2
Z
Z [B2 Case]
Z
Z [C, D2 Case]
(Unit: mm)
Case Code A B2 C D2
L 3.2 0.2 3.5 0.2 6.0 0.3 5.8 0.3
W1 1.6 0.2 2.8 0.2 3.2 0.3 4.6 0.3
W2 1.2 0.1 2.3 0.1 1.8 0.1 2.4 0.1
H 1.6 0.2 1.9 0.2 2.5 0.3 3.2 0.3
Z 0.8 0.3 0.8 0.3 1.3 0.3 1.3 0.3
0.4C -
The information in this document is subject to change without notice. Document No. EC0064EJ2V1DS00 (2nd edition) Date Published July 2000 P CP(K) Printed in Japan
W2
Y - -
(c)
1990 (1996)
SV/H SERIES
MARKING
- Upper face [A Case] polarity (anode) [B2 Case]
C105
capacitance code (pF) rated voltage code [A:10 V, C:16 V, D:20 V, E:25 V, V:35 V]
1 35N
capacitance (F) rated voltage
production date code rated voltage (V) polarity (anode)
[C Case] polarity (anode)
[D2 Case]
10 16N
- Bottom face (for A case sizes)
capacitance (F)
6.8 35N
capacitance (F)
production date code rated voltage (V)
production date code rated voltage (V) polarity (anode)
N
production date code
[Marking of production date code]
M Y 1995 1996 1997 1998
Jan. a n A N
Feb. b p B P
Mar. c q C Q
Apr. d r D R
May e s E S
Jun. f t F T
Jul. g u G U
Aug. h v H V
Sept. j w J W
Oct. k x K X
Nov. l y L Y
Dec. m z M Z
Data code will resume beginning in 1999.
2
SV/H SERIES
PRODUCT LINE UP AND CASE CODE
UR (Vdc) Capacitance (F) 0.1 0.15 0.22 0.33 0.47 0.68 1 1.5 2.2 3.3 4.7 6.8 10 15 22 33 D2 C D2 C D2 B2 C D2 A B2 C A A B2 B2 A A
10 V
16 V
20 V
25 V
35 V A A A A B2 B2 B2 C C C D2 D2
UR: Rated voltage
PART NUMBER SYSTEM
- Bulk -
SVH B2 1V 105 M
Capacitance Tolerance M : 20 % K : 10 % Capacitance Code in pF: First two digits represent significant figures. Third digit specifies number of zeros to follow. (105: 1 F) Rated Voltage (1A: 10 V, 1C: 16 V, 1D: 20 V, 1E: 25 V, 1V: 35 V) Case Code Series Name - Tape and Reel
TE SVH B2 1V 105M 8 R
R : negative terminal on sprocket hole side L : positive terminal on sprocket hole side
Packing orientation
Tape width 8 mm for A, B2 case 12 mm for C, D2 case Same as bulk part Tape and reel
3
SV/H SERIES
PERFORMANCE
No. 1 Items Operating Temp. Range -55 to +125C Specifications Test Conditions Applied voltage shall be derated over +85C 20 26 13 25 33 16 35 46 22 Vdc Vdc Vdc at 85C at 125C
2 3 4 5 6 7
Rated Voltage Surge Voltage Derated Voltage Capacitance Range Capacitance Tolerance Leakage Current
10 13 6.3
16 20 10
0.1 to 33 F 20%, 10% 0.01CV (A) or 0.5 (A) whichever is greater 0.1 to 4.7 F: 0.04 MAX. 6.8 to 33 F : 0.06 MAX. C/C : 5% Tangent of loss angle: initial requirement Leakage Current : initial requirement -55C 0 % -12 0.1 to 4.7 F: 0.08 MAX. 6.8 to 33 F : 0.10 MAX. -- +85C +12 % 0 initial requirement 0.1 CV or 5 A MAX. +125C +15 % 0 0.1 to 4.7 F: 0.06 MAX. 6.8 to 33 F : 0.08 MAX. 0.125 CV or 6.25 A MAX. IEC68-2-14 Test N and IEC68-22-33 Guidance -55C to +125C, 1000 cycles IEC68-2-58 Test Td Fully immersion to Solder 260C, 10 sec IEC68-2-3 Test Ca at 85C, 85% RH, 1000 h pull of 5N in an axial direction at 85C, Rated Voltage applied 2000 h at 120 Hz Rated Voltage applied after 5 minutes. at 120 Hz
8
Tangent of loss angle
9
Surge Voltage
at 85C, Rs = 1 k 1000 cycles
10
Characteristics at high
Temp. C/C
and low Tangent of temperature loss angle Leakge Current 11 Rapid change of temperature
C/C : 10% Tangent of loss angle: initial requirement Leakage Current : initial requirement C/C : 5% Tangent of loss angle: initial requirement Leakage Current : initial requirement C/C : 10% Tangent of loss angle: 150% of initial requirement Leakage Current : initial requirement There shall be no loosening or permanent damage C/C : 10% Tangent of loss angle: initial requirement Leakage Current : 125% of initial requirement C/C : 10% Tangent of loss angle: initial requirement Leakage Current : 125% of initial requirement 0.5%/1000 h
12
Resistance to Soldering
13
Damp Heat (steady state)
14
Terminal Strength
15
Endurance (1)
16
Endurance (2)
at 125C, Derated Voltage applied 2000 h
17
Failure Rate
each condition of No. 15 and No. 16 above
4
SV/H SERIES
STANDARD RATINGS
Rated Voltage (Vdc) Leakage Current (A) 0.5 0.5 1.5 3.3 0.5 0.5 0.5 1.6 3.5 0.5 0.5 1.4 3.0 0.5 0.5 1.1 2.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.7 1.2 1.6 2.3
Capacitance (F) 2.2 4.7
Tangent of loss angle 0.04 0.04 0.06 0.06 0.04 0.04 0.04 0.06 0.06 0.04 0.04 0.06 0.06 0.04 0.04 0.04 0.06 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.06
Case Code A B2 C D2 A A B2 C D2 A B2 C D2 A B2 C D2 A A A A B2 B2 B2 C C C D2 D2
Part Number
SVHA1A225M SVHB21A475M SVHC1A156M SVHD21A336M SVHA1C105M SVHA1C155M SVHB21C335M SVHC1C106M SVHD21C226M SVHA1D684M SVHB21D225M SVHC1D685M SVHD21D156M SVHA1E474M SVHB21E155M SVHC1E475M SVHD21E106M SVHA1V104M SVHA1V154M SVHA1V224M SVHA1V334M SVHB21V474M SVHB21V684M SVHB21V105M SVHC1V155M SVHC1V225M SVHC1V335M SVHD21V475M SVHD21V685M
10
15 33 1 1.5
16
3.3 10 22 0.68 2.2
20
6.8 15 0.47 1.5
25
4.7 10 0.1 0.15 0.22 0.33 0.47 0.68
35
1 1.5 2.2 3.3 4.7 6.8
5
SV/H SERIES
TAPE AND REEL SPECIFICATION
Carrier Tape Dimensions and Packaging Quantity
sprocket hole D
E
embossed cavity
A0
F B0 W
t K direction of feed
P
P2
P0
(Unit: mm) Case Code A B2 C D2 A0 0.2 1.9 3.3 3.7 5.1 B0 0.2 3.5 3.8 6.4 6.2 W 0.3 8.0 8.0 12.0 12.0 F 0.05 3.5 3.5 5.5 5.5 E 0.1 1.75 1.75 1.75 1.75 P 0.1 4.0 4.0 8.0 8.0 P2 0.05 2.0 2.0 2.0 2.0
Case Code A B2 C D2
P0 0.1 4.0 4.0 4.0 4.0
D +0.1 0
K 0.2 1.9 2.1 3.0 3.6
t 0.2 0.2 0.3 0.4
Q'ty/Reel 2 000 2 000 500 500
1.5 1.5 1.5 1.5
Reel Dimensions
W1 E D R
C
N
W2
Tape Width
(Unit: mm) Tape Width 8 12 A N C D E 2.0 0.5 2.0 0.5 W1 10.0 1.0 14.5 1.0 W2 14.5 max. 18.5 max. R 1 1
178 2.0 178 2.0
50 Min. 50 Min.
13 0.5 13 0.5
21 0.5 21 0.5
6
A
SV/H SERIES
CHARACTERISTICS DATA
Rapid change of temperature (-55C to +125C, n = 50)
6 4 C/C (%) C/C (%) Tangent of loss angle Leakage current ( A) 1000 cycles 2 0 -2 -4 -6
6 4 2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage current ( A)
0.1
0.1
0.01
0.01
0.001 initial 500 cycles 10 V/2.2 F
0.001 initial 500 cycles 35 V/0.33 F 1000 cycles
7
SV/H SERIES
Rapid change of temperature (-55C to +125C, n = 50)
6 4
C/C (%) C/C (%) Tangent of loss angle Leakage current ( A)
6 4 2 0 -2 -4 -6
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage current ( A)
0.1
0.1
0.01
0.01
0.001 initial 500 cycles 10 V/33 F 1000 cycles
0.001 initial 500 cycles 35 V/6.8 F 1000 cycles
8
SV/H SERIES
Damp heat (steady state) (85C, 85% RH, n = 50)
6 4
C/C (%) C/C (%) Tangent of loss angle Leakage current ( A)
6 4 2 0 -2 -4 -6
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage current ( A)
0.1
0.1
0.01
0.01
0.001 initial 500 h 10 V/2.2 F 1000 h
0.001 initial 500 h 35 V/0.33 F 1000 h
9
SV/H SERIES
Damp heat (steady state) (85C, 85% RH, n = 50)
6 4
C/C (%) C/C (%) Tangent of loss angle Leakage current ( A)
6 4 2 0 -2 -4 -6
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage current ( A)
0.1
0.1
0.01
0.01
0.001 initial 500 h 10 V/33 F 1000 h
0.001 initial 500 h 35 V/6.8 F 1000 h
10
SV/H SERIES
Endurance (85C, UR x 1.3 applied, n = 50) (reference data)
6 4
C/C (%) C/C (%) Tangent of loss angle Leakage current ( A)
6 4 2 0 -2 -4 -6
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage current ( A)
0.1
0.1
0.01
0.01
0.001 initial 500 h 10 V/2.2 F 1000 h
0.001 initial 500 h 35 V/0.33 F 1000 h
11
SV/H SERIES
Endurance (85C, UR x 1.3 applied, n = 50) (reference data)
6 4
C/C (%) C/C (%) Tangent of loss angle Leakage current ( A)
6 4 2 0 -2 -4 -6
2 0 -2 -4 -6
Tangent of loss angle
0.08 0.06 0.04 0.02 0
0.08 0.06 0.04 0.02 0
Leakage current ( A)
0.1
0.1
0.01
0.01
0.001 initial 500 h 10 V/33 F 1000 h
0.001 initial 500 h 35 V/6.8 F 1000 h
12
SV/H SERIES
FREQUENCY CHARACTERISTIC (reference data)
100 35 V/0.33 F
10
|Z| ()
16 V/22 F 35 V/1 F 1
10 V/33 F 0.1 1k
10 k
100 k Frequency (Hz)
1M
10 M
40 M
13
SV/H SERIES
GUIDE TO APPLICATIONS FOR TANTALUM CHIP CAPACITORS
The failure of the solid tantalum capacitor is mostly classified into a short-circuiting mode and a large leakage current mode. Refer to the following for reliable circuit design.
1. Field failure rate
SV/H Series tantalum chip capacitors are typically applied to decoupling, blocking, by-passing and filtering. The SV/H Series has a very low failure rate in the field. For example, the maximum field failure rate of an SV/H Series capacitor with a DC working voltage of 16 V is 0.0002 %/1000 hour (2 Fit) at an applied voltage of 5 V, operating temperature of 25C and series resistance of 3 . The maximum failure rate in the field is estimated by following expression:
V = 0 V0
3 T - T0 10
x 2
0 V T T0
: Maximum field failure rate : 0.5%/1000 hour (The failure rate of the SV/H Series at the full rated DC working voltage at operating temperature of 85C and series resistance of 3 .) : Applied voltage in actual use : Operating temperature in actual use : 85C
120 102 7 4
Failure rate multiplier F
V0 : Rated DC working voltage
The nomograph is provided for quick estimation of maximum field failure rates. Connect operating temperature T and applied voltage ratio V/V0 of interest with a straight line. The failure rate multiplier F is
1.0 0.9 0.8 0.7
Applied voltage ratio V/V0
110
2 100 10 7 4 2 90
Operating temperature T (C)
1
given at the intersection of this line with the model scale. The failure rate is obtained as = 0*F. Examples: Given V/V0 = 0.4 and T = 45C, read F = 4 x 10-3. Hence, = 0.002%/1000 hour (20 Fit). Given V/V0 = 0.3 and T = 25C, read F = 4 x 10-4. Hence, = 0.0002%/1000 hour (2 Fit).
100 7 4 2 10-1 7 4 2 10-2 7 4 2 10-3 7 4 2 10-4 7 4 2 10
-5
80
0.6 0.5 0.4
70
60
0.3
50
0.2
40
30
0.1
20
14
SV/H SERIES
2. Series resistance
As shown in Figure 1, reliability is increased by inserting a series resistance of at least 3 /V into circuits where current flow is momentary (switching circuits, charge/discharge circuits, etc.). If the capacitor is in a low-impedance circuit, the voltage applied to the capacitor should be less than 1/2 to 1/3 of the rated DC working voltage.
10
Magnification of failure
1
0.1
0.1
1
10
100
Series Resistance (/V)
Figure 1. Effects of Series Resistance
3. Ripple voltage
The sum of DC voltage and peak ripple voltage should not exceed the rated DC working voltage of the capacitor.
100 100
Ripple voltage (Vrms)
10
35 V 25 V 20 V 16 V 10 V
Ripple voltage (Vrms)
Case: A, B2 @ 25C
10
35 V 25 V 20 V 16 V 10 V
Case: C, D2 @ 25C
1
1
0.1 0.1 1 Frequency (kHz) 10 100
0.1 0.1 1 Frequency (kHz) 10 100
Figure 2. Permissible Ripple Voltage vs. Frequency Figure 2 is based on an ambient temperature of 25C. For higher temperature, permissible ripple voltage shall be derated as follows. Permissible voltage @ 50C = 0.7 x permissible voltage @25C Permissible voltage @ 85C = 0.5 x permissible voltage @25C Permissible voltage @ 125C = 0.3 x permissible voltage @25C
15
SV/H SERIES
4. Reverse voltage
Because the capacitors are polarized, reverse voltage should not be applied. If reverse voltage cannot be avoided because of circuit design, the voltage application should be for a very short time and should not exceed the following. 10% MAX. of rated DC working voltage @25C 5% MAX. of rated DC working voltage @85C 1% MAX. of rated DC working voltage @125C
5. Mounting
(1) Direct soldering Keep in mind the following points when soldering the capacitor by means of jet soldering or dip soldering: (a) Temporarily fixing resin Because the SV/H series solid tantalum capacitors are larger in size and subject to more force than the chip multilayer ceramic capacitors or chip resistors, more resin is required to temporarily secure the solid tantalum capacitors. However, if too much resin is used, the resin adhering to the patterns on a printed circuit board may adversely affect the solderability. (b) Pattern design
b
a
c
a
Case A B2 C D2
a 2.9 3.0 4.1 5.4
b 1.7 2.8 2.3 2.9
c 1.2 1.6 2.4 2.4
The above dimensions are for reference only. If the capacitor is to be mounted by this method, and if the pattern is too small, the solderability may be degraded. (c) Temperature and time Keep the peak temperature and time to within the following values: Solder temperature ............ 260C max. Time ................................. 10 seconds max. Whenever possible, perform preheating (at 150C max.) for smooth temperature profile. To maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. (d) Component layout If many types of chip components are mounted on a printed circuit board which is to be soldered by means of jet soldering, solderability may not be uniform over the entire board depending on the layout and density of the components on the board (also take into consideration generation of flux gas).
16
SV/H SERIES
(e) Flux Use resin-based flux. Do not use flux with strong acidity. (2) Reflow soldering Keep in mind the following points when soldering the capacitor in a soldering oven or with a hot plate: (a) Pattern design
b
a
c
a
Case A B2 C D2
a 1.6 1.6 2.4 2.4
b 1.7 2.8 2.3 2.9
c 1.2 1.6 2.4 2.4
The above dimensions are for reference only. Note that if the pattern is too big, the component may not be mounted in place. (b) Temperature and time Keep the peak temperature and time to within the following values: Solder temperature .............. 260C max. Time: 10 seconds max. Whenever possible, perform preheating (at 150C max.) for smooth temperature profile. To maintain the reliability, mount the capacitor at a low temperature and in a short time whenever possible. The peak temperature and time shown above are applicable when the capacitor is to be soldered in a soldering over or with a hot plate. When the capacitor is soldered by means of infrared reflow soldering, the internal temperature of the capacitor may rise beyond the surface temperature. (3) Using soldering iron When soldering the capacitor with a soldering iron, controlling the temperature at the tip of the soldering iron is very difficult. However, it is recommended that the following temperature and time be observed to maintain the reliability of the capacitor: Iron temperature ......... 300C max. Time ........................... 3 seconds max. Iron power .................. 30 W max.
17
SV/H SERIES
6. Cleaning
Generally, several organic solvents are used for flux cleaning of an electronic component after soldering. Many cleaning methods, such as immersion cleaning, rinse cleaning, brush cleaning, shower cleaning, vapor cleaning, and ultrasonic cleaning, are available, and one of these cleaning methods may be used alone or two or more may be used in combination. The temperature of the organic solvent may vary from room temperature to several 10C, depending on the desired effect. If cleaning is carried out with emphasis placed only on cleaning effect, however, the marking on the electronic component cleaned may be erased, the appearance of the component may be damaged, and in the worst case, the component may be functionally damaged. It is therefore recommended that the R series solid tantalum capacitor be cleaned under the following conditions: [Recommended conditions of flux cleaning] (1) Cleaning solvent ......... Chlorosen, isopropyl alcohol (2) Cleaning method ......... Shower cleaning, rinse cleaning, vapor cleaning (3) Cleaning time .............. 5 minutes max. *Ultrasonic cleaning This cleaning method is extremely effective for eliminating dust that has been generated as a result of mechanical processes, but may pose a problem depending on the condition. As a result of an experiment conducted by NEC, it was confirmed that the external terminals of the capacitor were cut when it was cleaned with some ultrasonic cleaning machines. The cause of this phenomenon is considered metal fatigue of the capacitor terminals that occurred due to ultrasonic cleaning. To prevent the terminal from being cut, decreasing the output power of the ultrasonic cleaning machine or shortening the cleaning time may be a possible solution. However, it is difficult to specify the safe cleaning conditions because there are many factors involved such as the conversion efficiency of the ultrasonic oscillator, transfer efficiency of the cleaning bath, difference in cleaning effect depending on the location in the cleaning bath, the size and quantity of the printed circuit boards to be cleaned, and the securing states of the components on the boards. It is therefore recommended that ultrasonic cleaning be avoided as much as possible. If ultrasonic cleaning is essential, make sure through experiments that no abnormality occur as a result of the cleaning. For further information, consult NEC.
18
SV/H SERIES
7. Others
(1) Do not apply excessive vibration and shock to the capacitor. (2) The solderability of the capacitor may be degraded by humidity. Store the capacitor at (-5 to +40C) room temperature and (40 to 60% RH) humidity. (3) Exercise care that no external force is applied to the tape packaged products (if the packaging material is deformed, the capacitor may not be automatically mounted by a chip mounted).
19
SV/H SERIES
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its e l e c t r o n i c components, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC electronic component, customers must incorporate sufficient safety measures in its design, such as redundancy, firecontainment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard," "Special," and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific a p p l i c a t i o n . T h e r e c o m m e n d e d applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical e q u i p m e n t ( n o t specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majorityowned subsidiaries. (2) "NEC electronic component products" means any electronic component product developed or manufactured by or for NEC (as defined above). DE0202

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